Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling
نویسندگان
چکیده
منابع مشابه
Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling
The ever increasing power density in modern semiconductor devices requires heat dissipation solution such as heat sink to remove heat away from the device. A compressive loading is usually applied to reduce the interfacial thermal resistance between package and heat sink. In this paper, both experimental approaches and numerical modeling were employed to study the effect of compressive loading ...
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ژورنال
عنوان ژورنال: Journal of Electronic Packaging
سال: 2012
ISSN: 1043-7398,1528-9044
DOI: 10.1115/1.4007674